SI/PI Applications Engineer - Taiwan

Challenges are our drive, innovation our calling. We at Kandou are a team of passionate accomplished professionals making a mark in the semiconductor industry. We're an innovative leader in high-speed and energy efficient chip-chip link solutions critical to the evolution of the electronics industry, continuously developing to meet the demands of not just the customers of today, but of tomorrow too. If you love to be part of a high-tech scale-up and are motivated by pushing your limits and challenging the status quo, we have an opportunity for you.


We are actively seeking a SI/PI Applications Engineer, based in Taiwan. 



  • Demonstrable expertise in high-speed signal circuit design, modelling, validation and debug
  • Interfacing and managing PCB manufacturing, layout and population suppliers for complex high speed signal designs
  • Detailed knowledge of signal and power integrity design, layout and manufacturing practices for high-speed differential pairs
  • Experienced with lab and debug equipment used for interrogation of high-speed signals
  • Awareness of customer manufacturing techniques, end of line testing, quality assurance and acceptance testing in a high-end consumer electronics environment
  • On site integration and bring up of hardware solutions at customers and ODMs
  • Working closely with internal engineering teams to leverage expertise, improve Kandou’s current solutions, develop IP and influence the roadmap
  • Provide technical expertise in both a pre- and post-sales engagements with field teams and customers for queries at all stages of the product lifecycle 
  • Development of customer facing technical collateral to assist in supporting, demonstrating, evaluating, promoting and selling Kandou's industry leading retimer and network connectivity products
  • Simulation of high-speed digital design and EMC/EMI testing and mitigation of field effects on signal integrity
  • Fluent in English spoken/written (Desirable). At least to be studying.
  • Ability to work at the System design level, but also in the circuit and register space
  • Experience in hardware failure analysis and root cause identification
  • In depth knowledge in circuit designs. Fundamental knowledge of power design, PCB Layout and Signal Integrity; hands-on experience
  • Experience on package, die, module or board level SIPI characterization by utilizing equipment (VNA, TDR and Oscilloscope).
  • Good understanding on the fundamental concepts of SI/PI, including s-parameter, transmission line, microwave theory, PDN, etc.
  • Solid knowledge of IBIS AMI based channel simulation, including parameter sweep, design tradeoffs, PDN etc.
  • Extensive experiences with Allegro PCB layout review and good command of SI/PI routing rules.
  • Plus points:
  • Allegro layout skills
  • Experiences with package material/technology
  • Experiences with IC design
  • Thermal simulations skills



  • Ability to work closely with a variety of internal teams in Hardware and Software Engineering, Systems, Field Applications Engineering, Sales, Marketing, Standards Bodies (USB-IF, PCI-Sig)
  • Strong communications skills, comfortable interfacing at all levels internally and within customers’ organizations
  • Track record of supporting complex customer designs from concept through to mass production
  • Strong team-player and practical hands-on problem solver
  • Ability to multitask in a high energy environment
  • Has the ability to drive architecture of both customer designs and internal reference designs
  • Excellent written and verbal communication skills and enthusiasm for solving customer problems in a collaborative manner
  • Comfortable interfacing and dealing with the demands with some of the largest electronics, OEMs, ODMs companies on the planet in the consumer electronics market
  • Experience with equipment used to replace electronic component, (soldering equipment).
  • Familiar with at least one popular simulation tools such as ADS, Hyperlynx, Nexxim, etc.



  • Work with overseas system design teams to evaluate design tradeoffs and optimize design performance / risk / cost / manufacturability through all design phases
  • Perform both pre/ post layout SI analysis for board level high-speed SerDes and model PDN
  • Provide best in class support to customers worldwide, to resolve challenging technical issues and ensure successful integration of Kandou’s IP and product solutions. 
  • Provide SI/PI support to customers and the field team during product design and/or product certification with requirements, design specifications and system debugging.
  • Provide direction for the business using demonstratable technical leadership acquired in high speed interface manufacturing, hardware integration and system level qualification.
  • Be a galvanizing force within the company linking sales, marketing, R&D, design and operations teams.
  • Corresponding design issues, customer issues, and internal deliverables to achieve the success. 


If this is the role you have been looking for and you want to be part of a growing Company, with an exciting future then we would really love to hear from you. Together We Kandou It!